Thermally Induced Vibration, Circular Plates

1. Tummala RR (2001) Fundamentals of microsystems packaging. McGraw-Hill International Edition, New York 2. JEDEC (2002) Design standard: design requirements for outlines of solid state and related products; JEDEC Publication 95, Design Guide 4.14-1/D, Ball Grid Array Package, JEDEC Solid State Technology Association 3. Vujosevic M (2006) Warpage of flip chip packages. In: Proceedings of IMECE2006, ASME international mechanical engineering congress and exposition, Chicago 4. Vujosevic M (2008) Thermally induced stresses in die-substrate assembly. Theor Appl Mech 35(1–3): 305–322 5. Ulrich RK, Williams DB (2006) Advanced electronic packaging, 2nd edn. Wiley, Chichester 6. Zeyfang R (1971) Stresses and strains in a plate bonded to a substrate: semiconductor devices. Solid State Electron 14:1035–1039 7. Suhir E (1986) Stresses in adhesively bonded bi-material assemblies used in electronic packaging. Mater Res Soc Proc 72:133–138 8. Suhir E (1986) Stresses in bi-material themostat. J Appl Mech 53:657–660 9. Suhir E (2000) Adhesively bonded assemblies with identical nondeformable adherents and “Piecewise Continuous” adhesive layer: predicted thermal stresses and displacements in the adhesive. Int J Solids Struct 37(16):2229–2252 10. Suhir E (2001) Analysis of interfacial thermal stresses in a trimaterial assembly. J Appl Phys 89:3685–3694 11. Timoshenko SP (1925) Analysis of bi-material thermostat. J Opt Soc Am 11:233–255 12. Tsai MY, Hsu CH, Han CN (2004) A note on Suhir’s solution of thermal stresses for die-substrate assembly. J Electron Packag 126:115–119 13. Timoshenko SP, Woinovski-Krieger S (1959) Theory of plates and shells, 2nd edn. McGraw-Hill, New York Thermally Induced Failure